SiP Design

SiP Design

Silansys has developed advanced stacked RF + SoC SiP products with leading Japanese and Taiwanese packaging providers on ceramic and plastic substrates.  These SiP products have achieved design-wins with leading Asian cellphone semiconductor and module providers.

Silansys managed mechanical design, placement of all components and routing of all internet connectivity to ensure that wideband RF performance met or even exceeded performance from applications boards.  3-D modelling and extraction is used to ensure high performance.